Sara Abbasirazgaleh – Seminar/Ph.D. Preliminary Defense, Tuesday, June 13, 2017 at 11:00 A.M.
JSNN – Sara Abbasirazgaleh – Ph.D. Preliminary Defense/Tuesday Seminar
Candidate: Sara Abbasirazgaleh
Advisor and Committee Chair: Shyam Aravamudhan, Ph.D.
Date: Tuesday, June 13, 2017
Time: 11:00 A.M. – 1:00 P.M.
Location: JSNN Auditorium2907 E. Gate City Blvd., Greensboro, NC 27401
Title: “Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental, and Health Effects.”
The overarching objective of this project is two-fold: (a) understand the effect of hexagonal boron nitride (hBN) nanoparticles as underfills in electronic packaging and (b) study the environmental and health impact of hBN released from electronic packages during manufacturing and disposal processes. The developments in Integrated Circuit (IC) technology has increased demand for smaller and higher density chips resulting in higher heat flux and the need for improved thermal transfer in electronics packaging. Failure and fatigue due to thermal stress caused by a mismatch in the coefficient of thermal expansion (CTE) between the chip and the substrate, has been a major challenge in electronics packaging. Underfills have been used in packaging to reduce CTE mismatch and to facilitate efficient heat transport. Achieving specific heat and thermal control through underfills has been made possible by tailoring thermal and physical properties of epoxy resin polymers. By incorporating nanofillers in epoxy polymers, the thermal, mechanical and electrical properties can be uniquely controlled. The effect of nanofillers, particularly nanoparticles are yet to be fully investigated. In this research, hexagonal boron nitride (hBN) particles of various sizes (70 nm, 150 nm and 1.5 µm) are explored as the filler material. hBN offers better thermal conductivity and mechanical stability, compared to other common filler particles, such as silver and silica. In the second phase of this project, the fate of hBN particles used in packaging is further studied by end-of-life cycle analysis. The physical and chemical properties are investigated after the electronic package disposal using thermal degradation recycling method. In addition, the nanoparticle interaction with the environment (soil) and human health (in vitro cell system) are being studied. It is envisioned that this research will: (a) provide better nanoscale fillers that will address the ever-increasing demand in electronic packaging and (b) elucidate manufacturing and end-of-life environmental and biological impact of hBN nanoparticles.