Sara Razgaleh – Seminar/PhD Thesis Defense – Friday, March 23, 2018 at 1:00 P.M.
JSNN – Sara Razgaleh – Ph.D. Thesis Defense/Friday Seminar
Candidate: Sara Abbasi Razgaleh
Major Advisor: Shyam Aravamudhan, Ph.D.
Time: 1:00 P.M. – 3:00 P.M.
Location: JSNN Auditorium2907 E. Gate City Blvd., Greensboro, NC 27401
Title: “Hexagonal Boron Nitride Nanoparticles in Electronic Packaging: Thermal, Environmental and Health Effects.”
Developments in integrated circuit (IC) technology has increased demand for smaller and higher density chips resulting in higher heat flux and the need for improved thermal transfer in electronics packaging. Achieving specific heat and thermal control through underfills has been made possible by tailoring thermal and physical properties of epoxy resin polymers. Using epoxy adhesives, not only is one able to control processing parameters; but also by incorporating fillers we can alter the thermal, mechanical and electrical properties of the adhesives for enhanced thermal management. Nanotechnology has paved the way to explore the application of nanometer size fillers in electronics packaging applications. Particles of nano dimensions and surface morphology may affect the properties of materials and its matrix environment uniquely. In this research, hexagonal boron nitride (hBN) is used as the filler material because it offers a higher thermal conductivity compared to other common filler particles, such as, silver and silica. In addition to thermal properties, the effect of hBN nanoparticles on occupational health has also been explored in this work.