Micro and Nanofabrication
Instrumentation | Description | Cost Per Hour (Industry) | Cost Per Hour (Academic/Gov't) |
|---|---|---|---|
Stratasys J750 FDM printer | The Stratasys J750™ 3D Printer delivers unrivaled aesthetic performance including true, full-color capability with texture mapping and color gradient | Contact for pricing | Contact for pricing |
Carbolite High Temp Furnace | This is a high temperature furnace for laboratory, research & process applications. | 61.00 | 30.50 |
Synthesis Lab General Use | This includes general use of synthesis lab and bench space. | 55.00 | 27.50 |
Cleanroom General Use | This includes entry fees to use cleanroom. | 130.00 | 65.00 |
Air Control Wet Bench - Poly | This 200 mm compatible wet bench is primarily used for general wet chemical etching. | included in cleanroom fee | included in cleanroom fee |
Air Control Wet Bench - Stainless | This 200 mm compatible wet bench is primarily used for CMOS-level cleans. | included in cleanroom fee | included in cleanroom fee |
Americhem Wet Bench | This 200 mm wet bench is primarily used for special etching purposes. | included in cleanroom fee | included in cleanroom fee |
Lam OnTrak DSS200 Series II Brush Cleaner | OnTrak DSS 200 Series 2 Double-sided PVA Scrubber is production-style tool for cleaning particles as small as 0.125 um in wafers up to 200mm. | 30.00 | 15.00 |
3DGence F350 3D Printer | This instrument is a dual extruder 3D printer designed for industrial applications. It is suitable for working with a wide range of technical materials including high-performance thermoplastics. | 10.00 (doesn't include cost of filament) | 5.00 (doesn't include cost of filament) |
IPEC Avanti CMP System | The IPEC 472 wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers used to achieve flatness, uniformity and planarization on patterned/device wafers. The 472 features automatic wafer handling and is capable of two platen, two-step polishing processing to maximize wafer throughput capability and quality. Designed to planarize wafers from 100mm to 200mm. | 30.00 | 15.00 |
Lam 4420B Plasma Etch System | This tool is primarily used for silicon, oxide and nitride etching using SF6 and CF4 based gas chemistry. | 30.00 | 15.00 |
Novellus Concept 2 PECVD System | This tool can deposit stress-controlled silicon dioxide and nitride on wafer stack. | 121.00 | 60.50 |
Plasmatherm ICP 770 DRIE | An ICP (inductively coupled plasma) etcher (DRIE) can be used to etch a variety of materials. This ICP is equipped with two chambers -- one is dedicated to deep anisotropic silicon (BOSCH process) trench etching and the other is used for silicon dioxide and polymer etching. | 80.00 | 40.00 |
PVD 75 Evaporation System | The evaporator can be used to deposit metals dielectrics. The tool has 5 e-beam pockets and 1 thermal boat. Single substrate up to 12" diameter -Multiple substrate up to 4" diameter -Substrate fixture rotation up to 20 rpm. | 30.00 | 15.00 |
PVD 75 Sputtering System | The sputterer can be used to deposit metals and dielectrics. The tool has 2 DC and 1 RF source. Coatings are performed by accelerating ions or an argon oxygen mixture into the surface of a sputter target, which is made of the material to be applied to the sample. -Sputter two or more dissimilar materials simultaneously for complete control of film stoichiometry (co-deposition). Single substrate up to 12" diameter -Multiple substrate up to 4" diameter -Substrate fixture rotation up to 20rpm. | 30.00 | 15.00 |
Veeco Savannah S200 Thermal ALD | This is a Thermal Atomic Layer Deposition system for dielectrics with In-Situ Ellipsometry. | 137.50 | 68.75 |
KLA Zeta 20 Optical Profiler | The Zeta™-20 is a fully integrated optical profiling microscope that provides 3D metrology and imaging capability in a compact, robust package. The system is powered by ZDot™ technology, which simultaneously collects high-resolution 3D data and a True Color infinite focus image. The Zeta-20 supports both R&D and production environments with Multi-Mode optics, easy-to-use software, and a low cost of ownership. | included in cleanroom fee | included in cleanroom fee |
Gaertner Ellipsometer | The model LSE-WS Stokes WAFERSKAN Ellipsometer is a high speed film thickness mapping system measuring one site per second including stage travel! It uses advanced StokesMeter technology to give tilt-free, focus free, 2D/3D color thickness and index images. | included in cleanroom fee | included in cleanroom fee |
Jandel Multi-Height 4 Point Probe | High quality, easy to use system for measuring the sheet resistance and/or volume resistivity of wafers up to 200mm in diameter. | included in cleanroom fee | included in cleanroom fee |
Laurell Spin Processor with Wet Station | This coater system can accommodate up to 200mm wafers with recommended rotational speed of 3000 RPM. | included in cleanroom fee | included in cleanroom fee |
OAI 8808 Mask Aligner | The OAI Model 8008 Mask Aligner is a semi-automated, four-camera, optical front and backside mask Aligner. It delivers ultra-precise (1m-2m) alignment accuracy. | 60.00 | 30.00 |
PE-100-RIE Plasma Etch System | This tool is capable of plasma cleaning or plasma etching with 300W 100KHz continuously variable power supply. | included in cleanroom fee | included in cleanroom fee |
Tousimis 916B Critical Point Dryer | This is a supercritical CPD MEMS dryer for 8" wafers. The temperature range is -30C to 60C, and the pressure range is 0 to 2000 psi. | 20.00 | 10.00 |
Ultron UH-102 UV Curing Oven | This tool provides for curing of UV films in easy-to-use benchtop packages, without sacrificing control or versatility. | included in cleanroom fee | included in cleanroom fee |
Vacuum Oven | This instrument is used to vacuum heat or cure substrates. | included in cleanroom fee | included in cleanroom fee |
MicroFab Jetlab 4 Ink Printer System | This tool can print droplets in an area of 160 X 120 mm with 20um accuracy. | 50.00 | 25.00 |
The service rate (staff labor) is $100 per hour for external for-profit organizations (industry) and $50 per hour for internal and external non-profit organizations (academic/government). All charges for service and for instrumentation are rounded to the nearest quarter hour. Note: Tools in the cleanroom will incur cleanroom use fees in addition to instrumentation rates, if applicable.